LOM, with its top notch fabricating offices give clients full turnkey answers for their items and creation needs. Components such as BGAs, uBGAs, PLCC, FPGA, bare dies, flip chips, OSC, and 3D Coplan can all be assembled on the fully automated high speed PCB assembly lines. With examined frameworks for cluster creation and part recognizability, our PCB gathering process guarantees the best nature of completed items to clients across the globe.